features mechanical specification case: m finish: all external surfaces are corrosion resistant and the contact areas are readily solderable maximum lead soldering temperature: 210 c, 3/8" case for 10 seconds at 5 lbs tension mounting position: any polarity: color band or diode symbol on case weight: 0.09 ounces (2.5 grams) o olded epoxy (ul flammability rating 94v-o) mechanical data maximum ratings & electrical characteristics ratings at 25 c ambient temperature unless otherwise specified. data sheet no. dr750-1a 25 amp lead mount button diodes die size: 0.165" x 0.165" square proprietary junction passivation for superior reliability and performance compact molded design high surge current, 600 a @ t = 175 c low cost peak performance at elevated temperatures: 35 a j o @ t = 175 c j o void free vacuum die soldering for maximum mechanical strength and heat dissipation (solder voids: typical < 2%, max. < 10% of die area) m f a b l l d e inchesmillimeters min dim a b d max max min 0.332 0.234 0.215 0.342 0.246 0.225 e 0.050 0.053 f 0.165 0.175 l 0.990 1.010 m 5 nom 5 nom non-repetitive peak reverse voltage (half wave, single phase, 60 hz peak) average forward rectified current @ t =150 c c o i o 25 peak forward surge current (8.3ms single half sine wave superimposed on rated load) i fsm 500 v rsm 60 120 240 480 720 parameter (test conditions) maximum dc blocking voltage maximum peak recurrent reverse voltage maximum rms voltage series number v rwm v dc v rrm symbol ratings 50 100 200 400 600 maximum forward voltage drop at 25 amp dc, 3/8" leads maximum instantaneous forward voltage drop at 100 amp v f v f 1.1 (typical 1.05) 1.25 amps units volts volts maximum thermal resistance, junction to case (note 1) maximum average dc reverse current at rated dc blocking voltage i rm r q jc @ t = 25 c a o @ t = 100 c a o 1 50 0.9 junction operating and storage temperature range t j ,t stg c/w m a c -65 to +175 notes: 1) both leads to heatsink, equal length m proprietary junction passivation for superior reliability and performance low forward voltage drop void free vacuum die soldering for maximum mechanical strength and heat dissipation (solder voids: typical < 2%, max. < 10% of die area) large die for high power heavy duty performance high heat handling capability with very low thermal stress dr750 dr751 dr752 dr754 dr756 mr750 mr751 mr752 mr754 mr756 fax : (973) 377-3078 phone: (973) 377-9566 www.americanmicrosemi.com madison, new jersey 07940 usa 133 kings road p.o. box 104 american microsemiconductor
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